JPH01319906A - フラットケーブル付き電子部品及びその製造方法 - Google Patents
フラットケーブル付き電子部品及びその製造方法Info
- Publication number
- JPH01319906A JPH01319906A JP15299288A JP15299288A JPH01319906A JP H01319906 A JPH01319906 A JP H01319906A JP 15299288 A JP15299288 A JP 15299288A JP 15299288 A JP15299288 A JP 15299288A JP H01319906 A JPH01319906 A JP H01319906A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- flat cable
- flexible substrate
- housing
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 229920005989 resin Polymers 0.000 claims description 169
- 239000011347 resin Substances 0.000 claims description 169
- 239000000758 substrate Substances 0.000 claims description 130
- 239000000463 material Substances 0.000 claims description 62
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 44
- 229920003002 synthetic resin Polymers 0.000 claims description 42
- 239000000057 synthetic resin Substances 0.000 claims description 42
- 239000012212 insulator Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 19
- 210000000078 claw Anatomy 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920001169 thermoplastic Polymers 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15299288A JPH01319906A (ja) | 1988-06-21 | 1988-06-21 | フラットケーブル付き電子部品及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15299288A JPH01319906A (ja) | 1988-06-21 | 1988-06-21 | フラットケーブル付き電子部品及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01319906A true JPH01319906A (ja) | 1989-12-26 |
| JPH0570285B2 JPH0570285B2 (en]) | 1993-10-04 |
Family
ID=15552593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15299288A Granted JPH01319906A (ja) | 1988-06-21 | 1988-06-21 | フラットケーブル付き電子部品及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01319906A (en]) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217601A (ja) * | 1984-04-12 | 1985-10-31 | アルプス電気株式会社 | 可変抵抗器 |
| JPS61203U (ja) * | 1984-06-05 | 1986-01-06 | 富士通テン株式会社 | 可変抵抗器 |
| JPS62190703A (ja) * | 1986-02-18 | 1987-08-20 | 松下電器産業株式会社 | 可変抵抗器用抵抗基体の製造方法 |
-
1988
- 1988-06-21 JP JP15299288A patent/JPH01319906A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217601A (ja) * | 1984-04-12 | 1985-10-31 | アルプス電気株式会社 | 可変抵抗器 |
| JPS61203U (ja) * | 1984-06-05 | 1986-01-06 | 富士通テン株式会社 | 可変抵抗器 |
| JPS62190703A (ja) * | 1986-02-18 | 1987-08-20 | 松下電器産業株式会社 | 可変抵抗器用抵抗基体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0570285B2 (en]) | 1993-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4920288B2 (ja) | 電子部品の回路基板への取付構造及び取付方法 | |
| EP0304112B1 (en) | Molded resin casing of electronic part incorporating flexible board | |
| US5071611A (en) | Method of making molded resin casing of electronic part with flat cable | |
| JPH0748330B2 (ja) | フレキシブル基板内蔵の電子部品樹脂モールドケース及びその製造方法 | |
| JP2603105B2 (ja) | 可変抵抗器とその製造方法 | |
| JPH01319906A (ja) | フラットケーブル付き電子部品及びその製造方法 | |
| KR20050103913A (ko) | 전자부품용 보드 및 그 제조방법 | |
| JPS60217601A (ja) | 可変抵抗器 | |
| JPH0714114B2 (ja) | フレキシブル基板を用いた電子部品のケース取付方法 | |
| JPH0160930B2 (en]) | ||
| JPH01303701A (ja) | 電子部品及びその製造方法 | |
| JP4371794B2 (ja) | 電子部品用基板 | |
| JP4213819B2 (ja) | 電子部品 | |
| JP4213820B2 (ja) | 電子部品 | |
| JP4360989B2 (ja) | 回転式電子部品用基板及び回転式電子部品用基板の製造方法 | |
| JPH0279493A (ja) | 電子部品実装体 | |
| JPH0256024B2 (en]) | ||
| JP4502876B2 (ja) | 基台付スイッチ基板及びその製造方法 | |
| JPH02170403A (ja) | 電子部品 | |
| JPH01166505A (ja) | 電子部品の筺体及びその製造方法 | |
| JP2001185406A (ja) | 回転式電子部品及びケース付き基板及びその製造方法 | |
| JP4213818B2 (ja) | 電子部品 | |
| JP2004266257A (ja) | 電子部品用基板の製造方法 | |
| JPS62162309A (ja) | 回転操作式多連電子部品 | |
| JPH0248124B2 (ja) | Kaitensosashikikogatadenshibuhin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081004 Year of fee payment: 15 |